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Hi

Hope you are doing well

I do have a position from one of our client. Below is the job description, let me know if you are interested.

Job title:–  Electronic Packaging / Mechanical Engineer

Location:- Phoenix, AZ, Grand Rapids, MI, USA (Onsite)

End-Client:- L3 Harris 

Job Description:-

 In this role, a successful candidate will be responsible for performing the mechanical engineering activities related to the design, analysis, documentation, processing, fabrication, assembly and qualification of electronic packaging. 

Responsibilities:

• Work closely with cross-functional teams in the development of new solutions.
• Strong engineering fundamentals and analytical background with the ability to understand and guide analyses and offer solutions related to mechanical, and electro-mechanical systems. Types of analysis include thermal, fluid, structural, and power.
• Develop and maintain traceability matrices to ensure all customer requirements are met throughout the design and development process.
• Familiarity with DO-160 and equivalent MIL-STD-810 tests to ensure the processor CCA can withstand environmental challenges such as salt fog and fluid susceptibility.
• Create complex mechanical designs and execute layouts for multiple products
• Demonstrated ability in packaging electrical components such as Circuit Cards, Connectors, and cables, including design, integration and validation in rugged environments including ground & avionics
• Demonstrated ability in developing, integrating, and validating mechanical, and electro-mechanical designs
• Lead the mechanical design, prototyping, testing, and troubleshooting of designs
• Experience in the design of additive manufactured parts, machined parts, weldments, sheet metal parts, and cable assemblies
• Lead thermal, vibration, and electrical bonding analyses to ensure the integrity and reliability of the processor CCA.
• Conduct design to cost initiatives to optimize product value while maintaining performance standards.
• Collaborate with cross-functional teams to integrate mechanical engineering perspectives into overall product development.

 Work Experience

Requirements:

• Bachelor’s degree in mechanical engineering or a related field; Master’s degree preferred.
• Minimum of 6 years of experience in mechanical engineering, specifically in the aerospace or defense industry.
• Experience with electronics packaging
• Proven track record of successful mechanical design and analysis in processor CCA development.
• Strong understanding of thermal dynamics, structural analysis, and electrical bonding principles.
• Experience with design to cost strategies and customer requirement traceability.
• Proficient in using CAD software and engineering analysis tools.
• Knowledge of DO-160, MIL-STD-810, MIL-STD-461, and other relevant military and aerospace standards.
• Familiarity with hermetic package design a plus
• Excellent problem-solving skills and the ability to work independently or as part of a team.
• Strong communication and documentation skills, with the ability to convey complex technical information effectively.
• Design for Manufacturability and Assembly (DFM/DFMA) experience

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