Hello !!
Here are the Requirement for the Below Position !!
Job Title : Electronic Packaging / Mechanical Engineer
Experience : 7+
Locations : Phoenix , AZ and Grand Rapids , MI
Work Authorization : GC AND USC
Tax Term : C2C
Tier : Working With IP ( QUEST GLOBAL )
End Client : L3 HARRIS
Job Description: Electronic Packaging / Mechanical Engineer
We are currently seeking a highly skilled and experienced Electronic Packaging / Mechanical Engineer to join our team at Quest Global. In this role, a successful candidate will be responsible for performing the mechanical engineering activities related to the design, analysis, documentation, processing, fabrication, assembly and qualification of electronic packaging.
Responsibilities:
Work closely with cross-functional teams in the development of new solutions.
Strong engineering fundamentals and analytical background with the ability to understand and guide analyses and offer solutions related to mechanical, and electro-mechanical systems. Types of analysis include thermal, fluid, structural, and power.
Develop and maintain traceability matrices to ensure all customer requirements are met throughout the design and development process.
Familiarity with DO-160 and equivalent MIL-STD-810 tests to ensure the processor CCA can withstand environmental challenges such as salt fog and fluid susceptibility.
Create complex mechanical designs and execute layouts for multiple products
Demonstrated ability in packaging electrical components such as Circuit Cards, Connectors, and cables, including design, integration and validation in rugged environments including ground & avionics
Demonstrated ability in developing, integrating, and validating mechanical, and electro-mechanical designs
Lead the mechanical design, prototyping, testing, and troubleshooting of designs
Experience in the design of additive manufactured parts, machined parts, weldments, sheet metal parts, and cable assemblies
Lead thermal, vibration, and electrical bonding analyses to ensure the integrity and reliability of the processor CCA.
Conduct design to cost initiatives to optimize product value while maintaining performance standards.
Collaborate with cross-functional teams to integrate mechanical engineering perspectives into overall product development.
Strong engineering fundamentals and analytical background with the ability to understand and guide analyses and offer solutions related to mechanical, and electro-mechanical systems. Types of analysis include thermal, fluid, structural, and power.
Develop and maintain traceability matrices to ensure all customer requirements are met throughout the design and development process.
Familiarity with DO-160 and equivalent MIL-STD-810 tests to ensure the processor CCA can withstand environmental challenges such as salt fog and fluid susceptibility.
Create complex mechanical designs and execute layouts for multiple products
Demonstrated ability in packaging electrical components such as Circuit Cards, Connectors, and cables, including design, integration and validation in rugged environments including ground & avionics
Demonstrated ability in developing, integrating, and validating mechanical, and electro-mechanical designs
Lead the mechanical design, prototyping, testing, and troubleshooting of designs
Experience in the design of additive manufactured parts, machined parts, weldments, sheet metal parts, and cable assemblies
Lead thermal, vibration, and electrical bonding analyses to ensure the integrity and reliability of the processor CCA.
Conduct design to cost initiatives to optimize product value while maintaining performance standards.
Collaborate with cross-functional teams to integrate mechanical engineering perspectives into overall product development.
Work Experience
Requirements:
Bachelor’s degree in mechanical engineering or a related field; Master’s degree preferred.
Minimum of 6 years of experience in mechanical engineering, specifically in the aerospace or defense industry.
Experience with electronics packaging
Proven track record of successful mechanical design and analysis in processor CCA development.
Strong understanding of thermal dynamics, structural analysis, and electrical bonding principles.
Experience with design to cost strategies and customer requirement traceability.
Proficient in using CAD software and engineering analysis tools.
Knowledge of DO-160, MIL-STD-810, MIL-STD-461, and other relevant military and aerospace standards.
Familiarity with hermetic package design a plus
Excellent problem-solving skills and the ability to work independently or as part of a team.
Strong communication and documentation skills, with the ability to convey complex technical information effectively.
Design for Manufacturability and Assembly (DFM/DFMA) experience
Minimum of 6 years of experience in mechanical engineering, specifically in the aerospace or defense industry.
Experience with electronics packaging
Proven track record of successful mechanical design and analysis in processor CCA development.
Strong understanding of thermal dynamics, structural analysis, and electrical bonding principles.
Experience with design to cost strategies and customer requirement traceability.
Proficient in using CAD software and engineering analysis tools.
Knowledge of DO-160, MIL-STD-810, MIL-STD-461, and other relevant military and aerospace standards.
Familiarity with hermetic package design a plus
Excellent problem-solving skills and the ability to work independently or as part of a team.
Strong communication and documentation skills, with the ability to convey complex technical information effectively.
Design for Manufacturability and Assembly (DFM/DFMA) experience
Regards,
Ritika Negi
Technical Recruiter
VSG Business Solutions Inc
3240 East State ST Ext Suite 203
Hamilton, New Jersey 08619
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